According to financial news on August 20, 2024, Tianyancha intellectual property information showed that Nanchong Sanhuan Electronics Co., Ltd. and Chaozhou Sanhuan (Group) Co., Ltd. obtained a project called "a multi-layer chip ceramic capacitor" and its preparation method", the authorization announcement number is CN117542655B, and the application date is December 2023.
The patent abstract shows that the present invention relates to a multilayer chip ceramic capacitor and a preparation method thereof, and belongs to the technical field of ceramic capacitors. From inside to outside, the external electrode is: a first metal layer, a first transition layer, a second metal layer, a second transition layer, a third metal layer, a third transition layer and a fourth metal layer; the first The metal layer is a coating layer, and the second metal layer, the third metal layer, and the fourth metal layer are all electroplating layers. The transition layer can prevent the plating solution from penetrating into each metal layer during the electroplating process and enhance its corrosion resistance. The existence of the transition layer can also make the same metal contact exist on the boundary between the outer electrode layers to increase the bonding force, solving the problem of poor density and reduced bonding force due to the first metal layer being a coating layer. The ceramic capacitor including the external electrode has good interlayer bonding force and density, is not prone to cracks, cracking, etc., and has excellent corrosion resistance.
Source: Financial Industry
